Version:  2.0.40 2.2.26 2.4.37 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.15 3.16 3.17 3.18 3.19 4.0 4.1 4.2 4.3 4.4 4.5

Linux/drivers/thermal/Kconfig

  1 #
  2 # Generic thermal sysfs drivers configuration
  3 #
  4 
  5 menuconfig THERMAL
  6         tristate "Generic Thermal sysfs driver"
  7         help
  8           Generic Thermal Sysfs driver offers a generic mechanism for
  9           thermal management. Usually it's made up of one or more thermal
 10           zone and cooling device.
 11           Each thermal zone contains its own temperature, trip points,
 12           cooling devices.
 13           All platforms with ACPI thermal support can use this driver.
 14           If you want this support, you should say Y or M here.
 15 
 16 if THERMAL
 17 
 18 config THERMAL_HWMON
 19         bool
 20         prompt "Expose thermal sensors as hwmon device"
 21         depends on HWMON=y || HWMON=THERMAL
 22         default y
 23         help
 24           In case a sensor is registered with the thermal
 25           framework, this option will also register it
 26           as a hwmon. The sensor will then have the common
 27           hwmon sysfs interface.
 28 
 29           Say 'Y' here if you want all thermal sensors to
 30           have hwmon sysfs interface too.
 31 
 32 config THERMAL_OF
 33         bool
 34         prompt "APIs to parse thermal data out of device tree"
 35         depends on OF
 36         default y
 37         help
 38           This options provides helpers to add the support to
 39           read and parse thermal data definitions out of the
 40           device tree blob.
 41 
 42           Say 'Y' here if you need to build thermal infrastructure
 43           based on device tree.
 44 
 45 config THERMAL_WRITABLE_TRIPS
 46         bool "Enable writable trip points"
 47         help
 48           This option allows the system integrator to choose whether
 49           trip temperatures can be changed from userspace. The
 50           writable trips need to be specified when setting up the
 51           thermal zone but the choice here takes precedence.
 52 
 53           Say 'Y' here if you would like to allow userspace tools to
 54           change trip temperatures.
 55 
 56 choice
 57         prompt "Default Thermal governor"
 58         default THERMAL_DEFAULT_GOV_STEP_WISE
 59         help
 60           This option sets which thermal governor shall be loaded at
 61           startup. If in doubt, select 'step_wise'.
 62 
 63 config THERMAL_DEFAULT_GOV_STEP_WISE
 64         bool "step_wise"
 65         select THERMAL_GOV_STEP_WISE
 66         help
 67           Use the step_wise governor as default. This throttles the
 68           devices one step at a time.
 69 
 70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
 71         bool "fair_share"
 72         select THERMAL_GOV_FAIR_SHARE
 73         help
 74           Use the fair_share governor as default. This throttles the
 75           devices based on their 'contribution' to a zone. The
 76           contribution should be provided through platform data.
 77 
 78 config THERMAL_DEFAULT_GOV_USER_SPACE
 79         bool "user_space"
 80         select THERMAL_GOV_USER_SPACE
 81         help
 82           Select this if you want to let the user space manage the
 83           platform thermals.
 84 
 85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
 86         bool "power_allocator"
 87         select THERMAL_GOV_POWER_ALLOCATOR
 88         help
 89           Select this if you want to control temperature based on
 90           system and device power allocation. This governor can only
 91           operate on cooling devices that implement the power API.
 92 
 93 endchoice
 94 
 95 config THERMAL_GOV_FAIR_SHARE
 96         bool "Fair-share thermal governor"
 97         help
 98           Enable this to manage platform thermals using fair-share governor.
 99 
100 config THERMAL_GOV_STEP_WISE
101         bool "Step_wise thermal governor"
102         help
103           Enable this to manage platform thermals using a simple linear
104           governor.
105 
106 config THERMAL_GOV_BANG_BANG
107         bool "Bang Bang thermal governor"
108         default n
109         help
110           Enable this to manage platform thermals using bang bang governor.
111 
112           Say 'Y' here if you want to use two point temperature regulation
113           used for fans without throttling.  Some fan drivers depend on this
114           governor to be enabled (e.g. acerhdf).
115 
116 config THERMAL_GOV_USER_SPACE
117         bool "User_space thermal governor"
118         help
119           Enable this to let the user space manage the platform thermals.
120 
121 config THERMAL_GOV_POWER_ALLOCATOR
122         bool "Power allocator thermal governor"
123         help
124           Enable this to manage platform thermals by dynamically
125           allocating and limiting power to devices.
126 
127 config CPU_THERMAL
128         bool "generic cpu cooling support"
129         depends on CPU_FREQ
130         depends on THERMAL_OF
131         help
132           This implements the generic cpu cooling mechanism through frequency
133           reduction. An ACPI version of this already exists
134           (drivers/acpi/processor_thermal.c).
135           This will be useful for platforms using the generic thermal interface
136           and not the ACPI interface.
137 
138           If you want this support, you should say Y here.
139 
140 config CLOCK_THERMAL
141         bool "Generic clock cooling support"
142         depends on COMMON_CLK
143         depends on PM_OPP
144         help
145           This entry implements the generic clock cooling mechanism through
146           frequency clipping. Typically used to cool off co-processors. The
147           device that is configured to use this cooling mechanism will be
148           controlled to reduce clock frequency whenever temperature is high.
149 
150 config DEVFREQ_THERMAL
151         bool "Generic device cooling support"
152         depends on PM_DEVFREQ
153         depends on PM_OPP
154         help
155           This implements the generic devfreq cooling mechanism through
156           frequency reduction for devices using devfreq.
157 
158           This will throttle the device by limiting the maximum allowed DVFS
159           frequency corresponding to the cooling level.
160 
161           In order to use the power extensions of the cooling device,
162           devfreq should use the simple_ondemand governor.
163 
164           If you want this support, you should say Y here.
165 
166 config THERMAL_EMULATION
167         bool "Thermal emulation mode support"
168         help
169           Enable this option to make a emul_temp sysfs node in thermal zone
170           directory to support temperature emulation. With emulation sysfs node,
171           user can manually input temperature and test the different trip
172           threshold behaviour for simulation purpose.
173 
174           WARNING: Be careful while enabling this option on production systems,
175           because userland can easily disable the thermal policy by simply
176           flooding this sysfs node with low temperature values.
177 
178 config HISI_THERMAL
179         tristate "Hisilicon thermal driver"
180         depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
181         help
182           Enable this to plug hisilicon's thermal sensor driver into the Linux
183           thermal framework. cpufreq is used as the cooling device to throttle
184           CPUs when the passive trip is crossed.
185 
186 config IMX_THERMAL
187         tristate "Temperature sensor driver for Freescale i.MX SoCs"
188         depends on CPU_THERMAL
189         depends on MFD_SYSCON
190         depends on OF
191         help
192           Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
193           It supports one critical trip point and one passive trip point.  The
194           cpufreq is used as the cooling device to throttle CPUs when the
195           passive trip is crossed.
196 
197 config SPEAR_THERMAL
198         tristate "SPEAr thermal sensor driver"
199         depends on PLAT_SPEAR || COMPILE_TEST
200         depends on OF
201         help
202           Enable this to plug the SPEAr thermal sensor driver into the Linux
203           thermal framework.
204 
205 config ROCKCHIP_THERMAL
206         tristate "Rockchip thermal driver"
207         depends on ARCH_ROCKCHIP || COMPILE_TEST
208         depends on RESET_CONTROLLER
209         help
210           Rockchip thermal driver provides support for Temperature sensor
211           ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
212           trip point. Cpufreq is used as the cooling device and will throttle
213           CPUs when the Temperature crosses the passive trip point.
214 
215 config RCAR_THERMAL
216         tristate "Renesas R-Car thermal driver"
217         depends on ARCH_SHMOBILE || COMPILE_TEST
218         depends on HAS_IOMEM
219         help
220           Enable this to plug the R-Car thermal sensor driver into the Linux
221           thermal framework.
222 
223 config KIRKWOOD_THERMAL
224         tristate "Temperature sensor on Marvell Kirkwood SoCs"
225         depends on MACH_KIRKWOOD || COMPILE_TEST
226         depends on OF
227         help
228           Support for the Kirkwood thermal sensor driver into the Linux thermal
229           framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
230 
231 config DOVE_THERMAL
232         tristate "Temperature sensor on Marvell Dove SoCs"
233         depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
234         depends on OF
235         help
236           Support for the Dove thermal sensor driver in the Linux thermal
237           framework.
238 
239 config DB8500_THERMAL
240         tristate "DB8500 thermal management"
241         depends on MFD_DB8500_PRCMU
242         default y
243         help
244           Adds DB8500 thermal management implementation according to the thermal
245           management framework. A thermal zone with several trip points will be
246           created. Cooling devices can be bound to the trip points to cool this
247           thermal zone if trip points reached.
248 
249 config ARMADA_THERMAL
250         tristate "Armada 370/XP thermal management"
251         depends on ARCH_MVEBU || COMPILE_TEST
252         depends on OF
253         help
254           Enable this option if you want to have support for thermal management
255           controller present in Armada 370 and Armada XP SoC.
256 
257 config TEGRA_SOCTHERM
258         tristate "Tegra SOCTHERM thermal management"
259         depends on ARCH_TEGRA
260         help
261           Enable this option for integrated thermal management support on NVIDIA
262           Tegra124 systems-on-chip. The driver supports four thermal zones
263           (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
264           zones to manage temperatures. This option is also required for the
265           emergency thermal reset (thermtrip) feature to function.
266 
267 config DB8500_CPUFREQ_COOLING
268         tristate "DB8500 cpufreq cooling"
269         depends on ARCH_U8500
270         depends on CPU_THERMAL
271         default y
272         help
273           Adds DB8500 cpufreq cooling devices, and these cooling devices can be
274           bound to thermal zone trip points. When a trip point reached, the
275           bound cpufreq cooling device turns active to set CPU frequency low to
276           cool down the CPU.
277 
278 config INTEL_POWERCLAMP
279         tristate "Intel PowerClamp idle injection driver"
280         depends on THERMAL
281         depends on X86
282         depends on CPU_SUP_INTEL
283         help
284           Enable this to enable Intel PowerClamp idle injection driver. This
285           enforce idle time which results in more package C-state residency. The
286           user interface is exposed via generic thermal framework.
287 
288 config X86_PKG_TEMP_THERMAL
289         tristate "X86 package temperature thermal driver"
290         depends on X86_THERMAL_VECTOR
291         select THERMAL_GOV_USER_SPACE
292         select THERMAL_WRITABLE_TRIPS
293         default m
294         help
295           Enable this to register CPU digital sensor for package temperature as
296           thermal zone. Each package will have its own thermal zone. There are
297           two trip points which can be set by user to get notifications via thermal
298           notification methods.
299 
300 config INTEL_SOC_DTS_IOSF_CORE
301         tristate
302         depends on X86
303         select IOSF_MBI
304         help
305           This is becoming a common feature for Intel SoCs to expose the additional
306           digital temperature sensors (DTSs) using side band interface (IOSF). This
307           implements the common set of helper functions to register, get temperature
308           and get/set thresholds on DTSs.
309 
310 config INTEL_SOC_DTS_THERMAL
311         tristate "Intel SoCs DTS thermal driver"
312         depends on X86
313         select INTEL_SOC_DTS_IOSF_CORE
314         select THERMAL_WRITABLE_TRIPS
315         help
316           Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
317           temperature sensor (DTS). These SoCs have two additional DTSs in
318           addition to DTSs on CPU cores. Each DTS will be registered as a
319           thermal zone. There are two trip points. One of the trip point can
320           be set by user mode programs to get notifications via Linux thermal
321           notification methods.The other trip is a critical trip point, which
322           was set by the driver based on the TJ MAX temperature.
323 
324 config INTEL_QUARK_DTS_THERMAL
325         tristate "Intel Quark DTS thermal driver"
326         depends on X86_INTEL_QUARK
327         help
328           Enable this to register Intel Quark SoC (e.g. X1000) platform digital
329           temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
330           The DTS will be registered as a thermal zone. There are two trip points:
331           hot & critical. The critical trip point default value is set by
332           underlying BIOS/Firmware.
333 
334 config INT340X_THERMAL
335         tristate "ACPI INT340X thermal drivers"
336         depends on X86 && ACPI
337         select THERMAL_GOV_USER_SPACE
338         select ACPI_THERMAL_REL
339         select ACPI_FAN
340         select INTEL_SOC_DTS_IOSF_CORE
341         select THERMAL_WRITABLE_TRIPS
342         help
343           Newer laptops and tablets that use ACPI may have thermal sensors and
344           other devices with thermal control capabilities outside the core
345           CPU/SOC, for thermal safety reasons.
346           They are exposed for the OS to use via the INT3400 ACPI device object
347           as the master, and INT3401~INT340B ACPI device objects as the slaves.
348           Enable this to expose the temperature information and cooling ability
349           from these objects to userspace via the normal thermal framework.
350           This means that a wide range of applications and GUI widgets can show
351           the information to the user or use this information for making
352           decisions. For example, the Intel Thermal Daemon can use this
353           information to allow the user to select his laptop to run without
354           turning on the fans.
355 
356 config ACPI_THERMAL_REL
357         tristate
358         depends on ACPI
359 
360 config INTEL_PCH_THERMAL
361         tristate "Intel PCH Thermal Reporting Driver"
362         depends on X86 && PCI
363         help
364           Enable this to support thermal reporting on certain intel PCHs.
365           Thermal reporting device will provide temperature reading,
366           programmable trip points and other information.
367 
368 menu "Texas Instruments thermal drivers"
369 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
370 source "drivers/thermal/ti-soc-thermal/Kconfig"
371 endmenu
372 
373 menu "Samsung thermal drivers"
374 depends on ARCH_EXYNOS || COMPILE_TEST
375 source "drivers/thermal/samsung/Kconfig"
376 endmenu
377 
378 menu "STMicroelectronics thermal drivers"
379 depends on ARCH_STI && OF
380 source "drivers/thermal/st/Kconfig"
381 endmenu
382 
383 config QCOM_SPMI_TEMP_ALARM
384         tristate "Qualcomm SPMI PMIC Temperature Alarm"
385         depends on OF && SPMI && IIO
386         select REGMAP_SPMI
387         help
388           This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
389           PMIC devices. It shows up in sysfs as a thermal sensor with multiple
390           trip points. The temperature reported by the thermal sensor reflects the
391           real time die temperature if an ADC is present or an estimate of the
392           temperature based upon the over temperature stage value.
393 
394 endif

This page was automatically generated by LXR 0.3.1 (source).  •  Linux is a registered trademark of Linus Torvalds  •  Contact us