Version:  2.0.40 2.2.26 2.4.37 3.9 3.10 3.11 3.12 3.13 3.14 3.15 3.16 3.17 3.18 3.19 4.0 4.1 4.2 4.3 4.4 4.5 4.6

Linux/drivers/thermal/Kconfig

  1 #
  2 # Generic thermal sysfs drivers configuration
  3 #
  4 
  5 menuconfig THERMAL
  6         tristate "Generic Thermal sysfs driver"
  7         help
  8           Generic Thermal Sysfs driver offers a generic mechanism for
  9           thermal management. Usually it's made up of one or more thermal
 10           zone and cooling device.
 11           Each thermal zone contains its own temperature, trip points,
 12           cooling devices.
 13           All platforms with ACPI thermal support can use this driver.
 14           If you want this support, you should say Y or M here.
 15 
 16 if THERMAL
 17 
 18 config THERMAL_HWMON
 19         bool
 20         prompt "Expose thermal sensors as hwmon device"
 21         depends on HWMON=y || HWMON=THERMAL
 22         default y
 23         help
 24           In case a sensor is registered with the thermal
 25           framework, this option will also register it
 26           as a hwmon. The sensor will then have the common
 27           hwmon sysfs interface.
 28 
 29           Say 'Y' here if you want all thermal sensors to
 30           have hwmon sysfs interface too.
 31 
 32 config THERMAL_OF
 33         bool
 34         prompt "APIs to parse thermal data out of device tree"
 35         depends on OF
 36         default y
 37         help
 38           This options provides helpers to add the support to
 39           read and parse thermal data definitions out of the
 40           device tree blob.
 41 
 42           Say 'Y' here if you need to build thermal infrastructure
 43           based on device tree.
 44 
 45 config THERMAL_WRITABLE_TRIPS
 46         bool "Enable writable trip points"
 47         help
 48           This option allows the system integrator to choose whether
 49           trip temperatures can be changed from userspace. The
 50           writable trips need to be specified when setting up the
 51           thermal zone but the choice here takes precedence.
 52 
 53           Say 'Y' here if you would like to allow userspace tools to
 54           change trip temperatures.
 55 
 56 choice
 57         prompt "Default Thermal governor"
 58         default THERMAL_DEFAULT_GOV_STEP_WISE
 59         help
 60           This option sets which thermal governor shall be loaded at
 61           startup. If in doubt, select 'step_wise'.
 62 
 63 config THERMAL_DEFAULT_GOV_STEP_WISE
 64         bool "step_wise"
 65         select THERMAL_GOV_STEP_WISE
 66         help
 67           Use the step_wise governor as default. This throttles the
 68           devices one step at a time.
 69 
 70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
 71         bool "fair_share"
 72         select THERMAL_GOV_FAIR_SHARE
 73         help
 74           Use the fair_share governor as default. This throttles the
 75           devices based on their 'contribution' to a zone. The
 76           contribution should be provided through platform data.
 77 
 78 config THERMAL_DEFAULT_GOV_USER_SPACE
 79         bool "user_space"
 80         select THERMAL_GOV_USER_SPACE
 81         help
 82           Select this if you want to let the user space manage the
 83           platform thermals.
 84 
 85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
 86         bool "power_allocator"
 87         select THERMAL_GOV_POWER_ALLOCATOR
 88         help
 89           Select this if you want to control temperature based on
 90           system and device power allocation. This governor can only
 91           operate on cooling devices that implement the power API.
 92 
 93 endchoice
 94 
 95 config THERMAL_GOV_FAIR_SHARE
 96         bool "Fair-share thermal governor"
 97         help
 98           Enable this to manage platform thermals using fair-share governor.
 99 
100 config THERMAL_GOV_STEP_WISE
101         bool "Step_wise thermal governor"
102         help
103           Enable this to manage platform thermals using a simple linear
104           governor.
105 
106 config THERMAL_GOV_BANG_BANG
107         bool "Bang Bang thermal governor"
108         default n
109         help
110           Enable this to manage platform thermals using bang bang governor.
111 
112           Say 'Y' here if you want to use two point temperature regulation
113           used for fans without throttling.  Some fan drivers depend on this
114           governor to be enabled (e.g. acerhdf).
115 
116 config THERMAL_GOV_USER_SPACE
117         bool "User_space thermal governor"
118         help
119           Enable this to let the user space manage the platform thermals.
120 
121 config THERMAL_GOV_POWER_ALLOCATOR
122         bool "Power allocator thermal governor"
123         help
124           Enable this to manage platform thermals by dynamically
125           allocating and limiting power to devices.
126 
127 config CPU_THERMAL
128         bool "generic cpu cooling support"
129         depends on CPU_FREQ
130         depends on THERMAL_OF
131         help
132           This implements the generic cpu cooling mechanism through frequency
133           reduction. An ACPI version of this already exists
134           (drivers/acpi/processor_thermal.c).
135           This will be useful for platforms using the generic thermal interface
136           and not the ACPI interface.
137 
138           If you want this support, you should say Y here.
139 
140 config CLOCK_THERMAL
141         bool "Generic clock cooling support"
142         depends on COMMON_CLK
143         depends on PM_OPP
144         help
145           This entry implements the generic clock cooling mechanism through
146           frequency clipping. Typically used to cool off co-processors. The
147           device that is configured to use this cooling mechanism will be
148           controlled to reduce clock frequency whenever temperature is high.
149 
150 config DEVFREQ_THERMAL
151         bool "Generic device cooling support"
152         depends on PM_DEVFREQ
153         depends on PM_OPP
154         help
155           This implements the generic devfreq cooling mechanism through
156           frequency reduction for devices using devfreq.
157 
158           This will throttle the device by limiting the maximum allowed DVFS
159           frequency corresponding to the cooling level.
160 
161           In order to use the power extensions of the cooling device,
162           devfreq should use the simple_ondemand governor.
163 
164           If you want this support, you should say Y here.
165 
166 config THERMAL_EMULATION
167         bool "Thermal emulation mode support"
168         help
169           Enable this option to make a emul_temp sysfs node in thermal zone
170           directory to support temperature emulation. With emulation sysfs node,
171           user can manually input temperature and test the different trip
172           threshold behaviour for simulation purpose.
173 
174           WARNING: Be careful while enabling this option on production systems,
175           because userland can easily disable the thermal policy by simply
176           flooding this sysfs node with low temperature values.
177 
178 config HISI_THERMAL
179         tristate "Hisilicon thermal driver"
180         depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
181         depends on HAS_IOMEM
182         help
183           Enable this to plug hisilicon's thermal sensor driver into the Linux
184           thermal framework. cpufreq is used as the cooling device to throttle
185           CPUs when the passive trip is crossed.
186 
187 config IMX_THERMAL
188         tristate "Temperature sensor driver for Freescale i.MX SoCs"
189         depends on CPU_THERMAL
190         depends on MFD_SYSCON
191         depends on OF
192         help
193           Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
194           It supports one critical trip point and one passive trip point.  The
195           cpufreq is used as the cooling device to throttle CPUs when the
196           passive trip is crossed.
197 
198 config SPEAR_THERMAL
199         tristate "SPEAr thermal sensor driver"
200         depends on PLAT_SPEAR || COMPILE_TEST
201         depends on HAS_IOMEM
202         depends on OF
203         help
204           Enable this to plug the SPEAr thermal sensor driver into the Linux
205           thermal framework.
206 
207 config ROCKCHIP_THERMAL
208         tristate "Rockchip thermal driver"
209         depends on ARCH_ROCKCHIP || COMPILE_TEST
210         depends on RESET_CONTROLLER
211         depends on HAS_IOMEM
212         help
213           Rockchip thermal driver provides support for Temperature sensor
214           ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
215           trip point. Cpufreq is used as the cooling device and will throttle
216           CPUs when the Temperature crosses the passive trip point.
217 
218 config RCAR_THERMAL
219         tristate "Renesas R-Car thermal driver"
220         depends on ARCH_RENESAS || COMPILE_TEST
221         depends on HAS_IOMEM
222         help
223           Enable this to plug the R-Car thermal sensor driver into the Linux
224           thermal framework.
225 
226 config KIRKWOOD_THERMAL
227         tristate "Temperature sensor on Marvell Kirkwood SoCs"
228         depends on MACH_KIRKWOOD || COMPILE_TEST
229         depends on HAS_IOMEM
230         depends on OF
231         help
232           Support for the Kirkwood thermal sensor driver into the Linux thermal
233           framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
234 
235 config DOVE_THERMAL
236         tristate "Temperature sensor on Marvell Dove SoCs"
237         depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
238         depends on HAS_IOMEM
239         depends on OF
240         help
241           Support for the Dove thermal sensor driver in the Linux thermal
242           framework.
243 
244 config DB8500_THERMAL
245         tristate "DB8500 thermal management"
246         depends on MFD_DB8500_PRCMU
247         default y
248         help
249           Adds DB8500 thermal management implementation according to the thermal
250           management framework. A thermal zone with several trip points will be
251           created. Cooling devices can be bound to the trip points to cool this
252           thermal zone if trip points reached.
253 
254 config ARMADA_THERMAL
255         tristate "Armada 370/XP thermal management"
256         depends on ARCH_MVEBU || COMPILE_TEST
257         depends on HAS_IOMEM
258         depends on OF
259         help
260           Enable this option if you want to have support for thermal management
261           controller present in Armada 370 and Armada XP SoC.
262 
263 config TEGRA_SOCTHERM
264         tristate "Tegra SOCTHERM thermal management"
265         depends on ARCH_TEGRA
266         help
267           Enable this option for integrated thermal management support on NVIDIA
268           Tegra124 systems-on-chip. The driver supports four thermal zones
269           (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
270           zones to manage temperatures. This option is also required for the
271           emergency thermal reset (thermtrip) feature to function.
272 
273 config DB8500_CPUFREQ_COOLING
274         tristate "DB8500 cpufreq cooling"
275         depends on ARCH_U8500 || COMPILE_TEST
276         depends on HAS_IOMEM
277         depends on CPU_THERMAL
278         default y
279         help
280           Adds DB8500 cpufreq cooling devices, and these cooling devices can be
281           bound to thermal zone trip points. When a trip point reached, the
282           bound cpufreq cooling device turns active to set CPU frequency low to
283           cool down the CPU.
284 
285 config INTEL_POWERCLAMP
286         tristate "Intel PowerClamp idle injection driver"
287         depends on THERMAL
288         depends on X86
289         depends on CPU_SUP_INTEL
290         help
291           Enable this to enable Intel PowerClamp idle injection driver. This
292           enforce idle time which results in more package C-state residency. The
293           user interface is exposed via generic thermal framework.
294 
295 config X86_PKG_TEMP_THERMAL
296         tristate "X86 package temperature thermal driver"
297         depends on X86_THERMAL_VECTOR
298         select THERMAL_GOV_USER_SPACE
299         select THERMAL_WRITABLE_TRIPS
300         default m
301         help
302           Enable this to register CPU digital sensor for package temperature as
303           thermal zone. Each package will have its own thermal zone. There are
304           two trip points which can be set by user to get notifications via thermal
305           notification methods.
306 
307 config INTEL_SOC_DTS_IOSF_CORE
308         tristate
309         depends on X86
310         select IOSF_MBI
311         help
312           This is becoming a common feature for Intel SoCs to expose the additional
313           digital temperature sensors (DTSs) using side band interface (IOSF). This
314           implements the common set of helper functions to register, get temperature
315           and get/set thresholds on DTSs.
316 
317 config INTEL_SOC_DTS_THERMAL
318         tristate "Intel SoCs DTS thermal driver"
319         depends on X86
320         select INTEL_SOC_DTS_IOSF_CORE
321         select THERMAL_WRITABLE_TRIPS
322         help
323           Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
324           temperature sensor (DTS). These SoCs have two additional DTSs in
325           addition to DTSs on CPU cores. Each DTS will be registered as a
326           thermal zone. There are two trip points. One of the trip point can
327           be set by user mode programs to get notifications via Linux thermal
328           notification methods.The other trip is a critical trip point, which
329           was set by the driver based on the TJ MAX temperature.
330 
331 config INTEL_QUARK_DTS_THERMAL
332         tristate "Intel Quark DTS thermal driver"
333         depends on X86_INTEL_QUARK
334         help
335           Enable this to register Intel Quark SoC (e.g. X1000) platform digital
336           temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
337           The DTS will be registered as a thermal zone. There are two trip points:
338           hot & critical. The critical trip point default value is set by
339           underlying BIOS/Firmware.
340 
341 config INT340X_THERMAL
342         tristate "ACPI INT340X thermal drivers"
343         depends on X86 && ACPI
344         select THERMAL_GOV_USER_SPACE
345         select ACPI_THERMAL_REL
346         select ACPI_FAN
347         select INTEL_SOC_DTS_IOSF_CORE
348         select THERMAL_WRITABLE_TRIPS
349         help
350           Newer laptops and tablets that use ACPI may have thermal sensors and
351           other devices with thermal control capabilities outside the core
352           CPU/SOC, for thermal safety reasons.
353           They are exposed for the OS to use via the INT3400 ACPI device object
354           as the master, and INT3401~INT340B ACPI device objects as the slaves.
355           Enable this to expose the temperature information and cooling ability
356           from these objects to userspace via the normal thermal framework.
357           This means that a wide range of applications and GUI widgets can show
358           the information to the user or use this information for making
359           decisions. For example, the Intel Thermal Daemon can use this
360           information to allow the user to select his laptop to run without
361           turning on the fans.
362 
363 config ACPI_THERMAL_REL
364         tristate
365         depends on ACPI
366 
367 config INTEL_PCH_THERMAL
368         tristate "Intel PCH Thermal Reporting Driver"
369         depends on X86 && PCI
370         help
371           Enable this to support thermal reporting on certain intel PCHs.
372           Thermal reporting device will provide temperature reading,
373           programmable trip points and other information.
374 
375 config MTK_THERMAL
376         tristate "Temperature sensor driver for mediatek SoCs"
377         depends on ARCH_MEDIATEK || COMPILE_TEST
378         depends on HAS_IOMEM
379         depends on NVMEM || NVMEM=n
380         depends on RESET_CONTROLLER
381         default y
382         help
383           Enable this option if you want to have support for thermal management
384           controller present in Mediatek SoCs
385 
386 menu "Texas Instruments thermal drivers"
387 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
388 depends on HAS_IOMEM
389 source "drivers/thermal/ti-soc-thermal/Kconfig"
390 endmenu
391 
392 menu "Samsung thermal drivers"
393 depends on ARCH_EXYNOS || COMPILE_TEST
394 source "drivers/thermal/samsung/Kconfig"
395 endmenu
396 
397 menu "STMicroelectronics thermal drivers"
398 depends on ARCH_STI && OF
399 source "drivers/thermal/st/Kconfig"
400 endmenu
401 
402 config QCOM_SPMI_TEMP_ALARM
403         tristate "Qualcomm SPMI PMIC Temperature Alarm"
404         depends on OF && SPMI && IIO
405         select REGMAP_SPMI
406         help
407           This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
408           PMIC devices. It shows up in sysfs as a thermal sensor with multiple
409           trip points. The temperature reported by the thermal sensor reflects the
410           real time die temperature if an ADC is present or an estimate of the
411           temperature based upon the over temperature stage value.
412 
413 endif

This page was automatically generated by LXR 0.3.1 (source).  •  Linux is a registered trademark of Linus Torvalds  •  Contact us